
Publication
Journal
Electric Current-Induced Monoclinic-to-Hexagonal Phase Transition of Cu6Sn5 at Low Temperatures
Acta Materialia (Under Review) | 2025
http://dx.doi.org/10.2139/ssrn.5405047
Shih-kang Lin*#, Shubhayan Mukherjee#, Yu-chen Liu, Jun Mizuno
National Cheng Kung University, Taiwan
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Materials Letter | 09/2025
https://doi.org/10.1016/j.matlet.2025.139482
Shubhayan Mukherjee, Akitsu Shigetou*, Yu-Hao Chou, Shih-kang Lin*
National Cheng Kung University, Taiwan
National Institute for Materials Science (NIMS), Japan​
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Note: * corresponding author, # co-first author
Conference Proceedings
Surface Modification of Cu Native Oxide: Ag Displacement for Homogeneous Layering
IEEE Xplore | April 2025 | Oral Presentation
10.23919/ICEP-IAAC64884.2025.11002905
Shubhayan Mukherjee, Akitsu Shigetou, Shih-kang Lin*
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Phase Transitions of the CU6Sn5 Phase Under Electric Currents
IEEE Xplore | April 2025 | Oral Presentation
10.23919/ICEP-IAAC64884.2025.11002910
Shubhayan Mukherjee, Yu-chen Liu, Shih-kang Lin*
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Impact of Electrical Current Stressing on η'-Cu6Sn5 in Electronics Packaging
IEEE Xplore | October 2024 | Oral Presentation
10.1109/IMPACT63555.2024.10818951
Shubhayan Mukherjee, Shih-kang Lin*
IOP Conference Series: Materials Science and Engineering | December 2020 | Oral Presentation
https://doi.org/10.1088/1757-899X/995/1/012046
Shubhayan Mukherjee*, Rakibul Biswas, Sannik Acharya
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Note: * corresponding author