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Electric Current-Induced Monoclinic-to-Hexagonal Phase Transition of Cu6Sn5 at Low Temperatures

Acta Materialia (Under Review) | 2025

http://dx.doi.org/10.2139/ssrn.5405047 

Shih-kang Lin*#, Shubhayan Mukherjee#Yu-chen Liu, Jun Mizuno

National Cheng Kung University, Taiwan

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Ar Fast Atom Beam (Ar-Fab) and Ethanol Vapor-Assisted Vacuum Ultraviolet (E-Vuv) Combined Cu Surface Modification for Dense Ag Deposition

Materials Letter | 09/2025

https://doi.org/10.1016/j.matlet.2025.139482 

Shubhayan Mukherjee, Akitsu Shigetou*, Yu-Hao Chou, Shih-kang Lin*

National Cheng Kung University, Taiwan

National Institute for Materials Science (NIMS), Japan​

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Note: * corresponding author, # co-first author

Conference Proceedings

Surface Modification of Cu Native Oxide: Ag Displacement for Homogeneous Layering

IEEE Xplore | April 2025 | Oral Presentation

10.23919/ICEP-IAAC64884.2025.11002905 

Shubhayan Mukherjee, Akitsu Shigetou, Shih-kang Lin*

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Phase Transitions of the CU6Sn5 Phase Under Electric Currents

IEEE Xplore | April 2025 | Oral Presentation

10.23919/ICEP-IAAC64884.2025.11002910 

Shubhayan Mukherjee, Yu-chen Liu, Shih-kang Lin*

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Impact of Electrical Current Stressing on η'-Cu6Sn5 in Electronics Packaging

IEEE Xplore | October 2024 | Oral Presentation

10.1109/IMPACT63555.2024.10818951 

Shubhayan Mukherjee, Shih-kang Lin*


Comparative Analysis of the Conventional Heat Treatment and Electro-Pulsing Treatment for the Microstructural Analysis

IOP Conference Series: Materials Science and Engineering | December 2020 | Oral Presentation

https://doi.org/10.1088/1757-899X/995/1/012046 

Shubhayan Mukherjee*, Rakibul Biswas, Sannik Acharya

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Note: * corresponding author

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