Publication

Surface Modification of Cu Native Oxide: Ag Displacement for Homogeneous Layering

IEEE Xplore | April 2025 | Oral Presentation

10.23919/ICEP-IAAC64884.2025.11002905 

Shubhayan Mukherjee, Akitsu Shigetou, Shih-kang Lin*

​

Phase Transitions of the CU6Sn5 Phase Under Electric Currents

IEEE Xplore | April 2025 | Oral Presentation

10.23919/ICEP-IAAC64884.2025.11002910 

Shubhayan Mukherjee, Yu-chen Liu, Shih-kang Lin*

​

Impact of Electrical Current Stressing on η'-Cu6Sn5 in Electronics Packaging

IEEE Xplore | October 2024 | Oral Presentation

10.1109/IMPACT63555.2024.10818951 

Shubhayan Mukherjee, Shih-kang Lin*

Comparative Analysis of the Conventional Heat Treatment and Electro-Pulsing Treatment for the Microstructural Analysis

IOP Conference Series: Materials Science and Engineering | December 2020 | Oral Presentation

https://doi.org/10.1088/1757-899X/995/1/012046 

Shubhayan Mukherjee*, Rakibul Biswas, Sannik Acharya

​

Note: * corresponding author