Background

About
 

I am an experimental researcher in materials and condensed matter physics, with a focus on understanding how electrical, thermal, and mechanical fields couple to atomic-scale structure and stability in functional alloys and intermetallic compounds.

My core expertise lies in solid-state physics, thermodynamics, and electrodynamics, applied to study phase transformations, defect evolution, and electromigration phenomena in Cu–Sn–based systems relevant to microelectronics. Using synchrotron-based in-situ and ex-situ probes — including X-ray diffraction, white Laue nanodiffraction (XND), and electron backscatter diffraction (EBSD) — combined with nanoscale mechanical testing, I investigate how electric current and temperature perturb lattice order, grain structure, and microstructural evolution.

In addition to bulk and intermetallic systems, I also work on surface modification and thin-film growth mechanisms, particularly how surface energetics and nucleation physics can be tuned to control film morphology, suppress dendritic growth, and stabilize interfacial reactions. This integrates concepts of interfacial free energy, nucleation barriers, and coupled anodic–cathodic processes with experimental techniques such as Ar-FAB, VUV irradiation, XPS, and SEM.

Alongside my own research, I mentor Master’s students on electromigration in noble metals (Au, Ag) and current-stressed mechanical behavior in Cu micropillars. These collaborative efforts broaden the scope of current-induced phenomena from the lattice scale to device-relevant microstructures, advancing our understanding of electronic material reliability.

My broader aim is to uncover the physics of coupled electrical, mechanical, and structural responses in metals and intermetallics, bridging atomic mechanisms with macroscopic reliability in solder joints, interconnects, and next-generation lead-free alloys.