Disciplines

Experimental Materials Physics | Crystallography | Intermetallic Compound (IMC) | Electromigration | Electroplasticity | Phase Stability | Synchrotron Radiation | Surface Modification 

About

As a doctoral student in Materials Science, I am conducting research on the influence of electrical current on the phase stability of intermetallic compounds within electronic solder joints. In my research, I am particularly focused on studying the impact of high electrical current density on lead-free materials, specifically within the bulk Cu-Sn system. Intermetallic compounds, which commonly form at the bonding interface, play a critical role in determining the reliability of interconnections. One prominent intermetallic compound, Cu6Sn5, exhibits both hexagonal (ƞ) and monoclinic (ƞ') structures above and below the transition temperature of 186℃, respectively. However, the influence of electric current on the ƞ and ƞ' phases and their transition remains an area of uncertainty. To address this gap, we have fabricated single-phase ƞ and ƞ' samples and conducted comprehensive analyses of their phase stability and mechanical changes through morphological and crystallographic examinations.
I have extended my work on binary alloy Cu-Sn to encompass ternary alloys like (Cu,Ni)-Sn, aiming to observe their phase behavior under current stressing conditions. Additionally, I serve as an instrumental member in the experimental investigations conducted at the Synchrotron radiation-based X-ray scattering facility and Laue white light nanodiffraction.

In addition to my primary focus, I am actively involved in several supplementary research endeavors. These include microstructural analysis and electromigration studies of pure materials such as Gold (Au). Furthermore, I am engaged in the investigation of stress-strain profiling of pillar-shaped pure materials like Copper (Cu) using the Nanoindentation ECM module. I have also contributed to the observation of electrical current stressing in T6-AA7075 material.

​

Skills

Scanning Electron Microscopy (SEM) | Electron Back Scattered Diffraction (EBSD) | Energy Dispersive Spectroscopy (EDS) | X-Ray Diffraction (XRD) | Transmission Electron Microscopy (TEM) | ARC melting furnace | Nanoindentation | Laue White Light Nanodiffraction | Synchrotron Radiation (TLS & TPS, NSRRC, Taiwan) | X-ray photoelectron spectroscopy (XPS) | Ar Fast atom bombardment (FAB) Irradiation | Vacuum Ultraviolet (VUV) Surface Treatment | Raman Spectroscopy

​​​